SK Hynix announces HBM3 memory with bandwidth of 819GB/s per module

SK Hynix has completed the development of its first HBM3 memory modules. This memory would offer a bandwidth of up to 819GB/s per module. That’s an improvement over HBM2E, which has a maximum bandwidth of 460GB/s.

SK Hynix reports that it will offer HBM3 modules in two different capacities. The company comes with modules of 24GB and 16GB, which respectively consist of ‘stacks’ of twelve and eight 16Gbit layers. These layers are interconnected with TSVs and use a 1024 bit memory bus. The modules would also support a bandwidth of 6.4 Gbit/s per pin, Anandtech writes. According to the manufacturer, this equates to a maximum bandwidth of approximately 819GB/s per module. HBM3 will also receive on-die ecc, the manufacturer reports.

SK Hynix claims in its press release that it is the first company to have completed the development of its HBM3 memory technology. It is striking that standardization organization Jedec itself has not yet made specifications for HBM3 available. It is not yet known when the first products with HBM3 will appear on the market. Micron already hinted last year that it was working on HBMnext, which could indicate HBM3. That memory should appear at the end of 2022.