Shuttle Announces Compact DH670 Barebone for Intel Alder Lake Processors

Shuttle introduces an XPC Slim DH670 barebone with an Intel H670 chip dry and room for a twelfth generation Intel Alder Lake processor. The mini PC will also have four connections for monitors. The company is not yet reporting a suggested retail price.

The Shuttle XPC Slim DH670 consists of a 1.5l housing. It is 43mm high, 165mm wide and 190mm deep. The housing contains an H670 motherboard and an LGA1700 socket, which fits an Alder Lake processor. According to Shuttle, the system is suitable for processors with a TDP of up to 65W. In practice, these are non-overclockable models, such as the Core i9-12900, Core i7-12700 or Core i5-12400. The system uses the integrated GPU of the processors.

There are also two so-dimm slots for DDR4 memory, with support for up to 64GB of memory. In terms of storage, the barebone will accommodate an M.2 SSD with PCIe 4.0 interface and a 2.5″ drive. As this is a barebone, users will have to purchase their own processor, memory and storage drives. There is also an M .2 2230 slot for an optional Wi-Fi module, two RJ45 connectors for Gigabit Ethernet on the back, and two HDMI 2.0 connectors, two DisplayPort connectors and a total of eight USB connectors.

The barebone comes with a DC power supply with a power of 120W. According to Shuttle, the system is available immediately, although it is not yet available in web shops. The company is also not yet reporting a suggested retail price for the system.