Toshiba presents single package SSD with a thickness of 1.3mm
Toshiba releases a compact NVME SSD based on its 64-layer 3D TLC NAND. It is an SSD without DRAM, so that the size can be limited and Toshiba can keep costs low. The thickness is 1.3mm.
The BG3 SSDs are based on a single package design that integrates the Toshiba controller and flash memory. The SSDs have no dram; Toshiba uses the host memory buffer functionality as described in the nvme revision 1.2.1 specification.
The PCI-E 3.0 x2 SSDs deliver sequential read speeds of up to 1520MB/s and write speeds of up to 840MB/s. They will be available in bga variants with m2 1620 form factor and as removable m2 2230 modules. Toshiba releases the BG3 SSDs with storage quantities of 128GB, 256GB and 512GB.
The company is currently sending the first samples to partners. It is unknown when the BG3 series will be available.