MediaTek introduces Dimensity 1100 and 1200 socs for 5G smartphones

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MediaTek introduces new flagship socs for smartphones. The Dimensity 1100 and 1200 are made on TSMC’s 6nm process and have an integrated 5G modem. The first phones with these chips would appear in the first quarter of this year.

The MediaTek Dimensity 1200 and 1100 have four fast Cortex-A78 cores and just as many more economical A55 cores. In addition, the 1200 variant has one A78 core that runs at 3.0GHz, in addition to three A78 cores at 2.6GHz. With the Dimensity 1100, the clock speeds of these cores are all at 2.6GHz. The A55 cores are clocked at 2.0GHz on both chips.

Both chips have the same Mali G77 GPU from Arm, which was also used for the Dimensity 1000 from 2019. The new Dimensity 1100 and 1200 are produced on TSMC’s N6 node, which is an improved version of the 7nm process of those chips. manufacturer and uses euv.

MediaTek is equipping its Dimensity 1100 and 1200 SOCs with an integrated 5G modem, supporting sub-6GHz frequencies with dual sim, dual standby. The chips do not support mmWave-5G. In terms of connectivity, the two socs also offer Wi-Fi 6 and Bluetooth 5.2.

In terms of screens, the Dimensity 1200 supports Full-HD+ displays at 168Hz refresh rate and QHD+ displays at 90Hz. With the 1100 variant, this is 144Hz and 90Hz respectively. The camera support also differs, with the Dimensity 1200 being able to handle a single 200-megapixel camera or a setup with a 32-megapixel camera and 16-megapixel sensor. The Dimensity 1100 supports up to a single camera with a resolution of 108 megapixels, or an equal setup with two camera sensors.

MediaTek announces that the first smartphones with Dimensity 1100 or 1200 SOCs will be released in the first quarter of 2021. The company reports in a press release that manufacturers such as Xiaomi, Oppo, Vivo and Realme have shown interest in the smartphone chips. MediaTek already announced the introduction of its new Dimensity SOCs last week.

New MediaTek Dimensity Chips

social Dimension 1200 Dimension 1100
cores 1x Cortex-A78, 3.0GHz
3x Cortex-A78, 2.6GHz
4x Cortex-A55, 2.0GHz
4x Cortex-A78, 2.6GHz
4x Cortex-A55, 2.0GHz
GPU Arm Mali G77 MC9 Arm Mali G77 MC9
Process TSMC 6nm TSMC 6nm
Memory Max. 16GB Lpddr4x-4266 Max. 16GB Lpddr4x-4266
Storage UFS 3.1 UFS 3.1
Camera Single camera: max. 200Mp
Two cameras: max. 32Mp and 16Mp
Single camera: max. 200Mp
Two cameras: max. 32Mp and 16Mp
Screen Full HD+: up to 168Hz
QHD+: max. 90Hz
Full HD+: up to 144Hz
QHD+: max. 90Hz
Modem 5G (Sub-6GHz):
Nsa (non-standalone)
5GSa (standalone)
Carrier aggregation (2cc)
Fdd and Tdd
VoNR
DSS
Dual SIM, Dual Standby
5G (Sub-6GHz):
Nsa (non-standalone)
5GSa (standalone)
Carrier aggregation (2cc)
Fdd and Tdd
VoNR
DSS
Dual SIM, Dual Standby
Connectivity Bluetooth 5.2
WiFi 6
Bluetooth 5.2
WiFi 6
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