Ace’s Hardware has posted a transcript of the presentations AMD and Micron gave at the DDR SDRAM Industry Summit. We do not find out much new information, but Micron does report that work is now underway on the successor to the PC2100 standard. This new specification is called PC2600 and appears to run at a clock speed of 166MHz:
AMD (Ron Huff):
Next year we plan on introducing an eighth generation core, currently called SledgeHammer. This will be x.86-64. This product will not only have the capability to execute 64 bit instructions, but will also be optimized to compete in the high end of the x.86-32 bit market as well. In order to see this high performance processor, we will be introducing an interconnect technology we call LDT, which is a very high speed I/O bus which will be useful in creating a pipe in into the core logic of the system to enable next generation I/O technologies like 1394-B gigabit ethernet as well as PCIX.
Here again we talk about SledgeHammer, our next generation, eighth generation core. Let’s see how DDR fits into our platform strategy for 2000. When we introduce, in the second half of the year, DDR support, we will have chipsets from AMD, Via and ALi. The 760 chipset, which we are previewing today outside the door of this room, is a DDR technology demonstration of this product which we intend to launch in the second half of this year. Most significantly it supports the DDR standard PC2100 and 1600. In the midrange space we will also be, as we work with our third party chipset vendors, introducing DMA, or sometimes known as SMA chipsets supporting PC133 and PC100. And just give a few more points on feature set of the AMD 760 chipset, we’ll also have a version called the 760MP, supporting 1 and 2 processors. It will support up to four DIMMs, unbuffered and buffered DIMMS, a next generation ATA interface for disk drives. These are the enhancing features of these chipsets.
Micron (Mike Seibert):
On the DIMM side, we’ve got a little bit different nomenclature than what we’ve used in the past. We still use PC, but we use 2100 and 1600. So 2100, 1600, and we have three module types, which our other presenters have talked about in some detail already. We have the 184 pin larger DIMM, registered and unbuffered. And we have the new 200 pin SO-DIMM development going on as well. And we’re working on the initial rounds of common Gerber development on the unbuffered SO-DIMM.
We’re also in the initial stages of looking at trying to move this technology one more speed grade beyond PC2100. Initial work is getting started, as Eric alluded to in his presentation, in developing platform technology for PC2600. And there is a few things going on in that area right now. That will be a matter of development for the second half of this year, first part of next year. See what we can do to squeeze another speed rate out of DDR as we did with 100 as we went to 133. Probably look at doing a little package technology and system constraints to keep the loading down and clock speeds up to 167 and a 333 megahertz data rate. So in conclusion, I think it’s probably evident by now that we’re, from a DRAM supply side we’re ready to ramp this product and we’re waiting for the chipsets to come along.
thanks DiGiSTORM for the tip.