Micron releases packages that combine UFS 3.1 storage with Lpddr5 ram
Micron has mass-produced its multichip packages combining UFS 3.1 storage and Lpddr5 working memory. The chips are intended for smartphones. Combining flash storage with working memory in one package saves space.
Micron claims that UFS 3.1 and Lpddr5 with its new multichip packages will be available for more phones. These types of flash storage and working memory are currently mainly found in the most expensive smartphones from manufacturers. Micron also states that the chips are useful for 5G smartphones, because of the high speed of the storage and working memory.
The packages have a 297-ball grid array and, according to a previous announcement from Micron, the combination of nand memory and ram in one package provides a 40 percent space saving compared to a smartphone using separate packages for the memory and ram.
Micron has four uMCP5 packages ready for mass production. There is a choice of variants with 128GB or 256GB storage space, both versions are available with 8GB or 12GB Lpddr5 memory. According to the press release, there is also a variant with 512GB of storage space and 12GB of ram, but Micron does not yet mention it among the variants that are in mass production.